Clip and heat sink assembly having the same

ABSTRACT

A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and a fin extending upwardly from the base. The clip is mounted on the fin and can be removed therefrom by moving upwardly along a height direction of the fin. The clip includes a resisting part contacting with a side of the fin, two locking parts respectively connected to two ends of the resisting part for securing the heat sink to a printed circuit board, and two stopping parts engaging with two opposites ends and an opposite side of the fin for preventing the clip from moving along widthwise and thickness directions of the fin. The two stopping parts are connected to the resisting part and located between the two locking parts.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to clips and, particularly, to a clipcapable of being conveniently assembled to and disassembled from a heatsink, and a heat sink assembly having such a heat sink and clip.

2. Description of Related Art

A heat sink is usually placed in thermal contact with a heat generatingelectronic device such a central processing unit (CPU), and transfersheat through conduction away from the heat generating electronic deviceso as to prevent over-heating of the heat generating electronic device.Usually, a heat sink is secured to the heat generating electronic deviceby using a clip. Generally, the clip is secured to the heat sink byseveral bolts to get a heat sink assembly. In assembling anddisassembling processes of the heat sink assembly, additional tools areneeded, and these processes are complex and time-consuming.

What is needed, therefore, is a clip capable of being convenientlyassembled to and disassembled from a heat sink, thereby to overcome theabove-described problems.

SUMMARY OF THE INVENTION

An exemplary embodiment of a heat sink assembly for dissipating heatgenerated by a heat generating electronic device is provided. The heatsink assembly includes a heat sink and at least one clip. The heat sinkincludes a base and a fin array extending from a top surface of thebase. The at least one clip is removably mounted to at least one fin ofthe fin array. The at least one clip includes a resisting part, twolocking parts and two stopping parts. The resisting part is provided forcontacting with the at least one fin of the fin array. The two lockingparts are respectively connected to two ends of the resisting part, andprovided for securing the base of the heat sink to a printed circuitboard on which the heat generating electronic device is mounted. The twostopping parts are provided for preventing the at least one clip frommoving along a widthwise direction of the at least one fin when the atleast one clip is mounted to the at least one fin. Furthermore, the twostopping parts cooperate with the resisting part to prevent the at leastone clip from moving along a thickness direction of the at least onefin. The two stopping parts are connected to the resisting part andlocated between the two locking parts. The at least one clip is mountedto the at least one fin along a top-to-bottom direction thereof, andremovable therefrom along a bottom-to-top direction.

Advantages and novel features will become more apparent from thefollowing detailed description when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiment can be better understood withreference to the following drawings. The components in the drawings arenot necessarily drawn to scale, the emphasis instead being placed uponclearly illustrating the principles of the present embodiment. Moreover,in the drawings, like reference numerals designate corresponding partsthroughout the several views.

FIG. 1 is an isometric, exploded view of a heat sink assembly inaccordance with an exemplary embodiment of the present disclosure.

FIG. 2 is an assembled view the heat sink assembly of FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

An embodiment will now be described in detail below and with referenceto the drawings.

Referring to FIG. 1, an exemplary embodiment of a heat sink assembly 100includes a heat sink 10 and two clips 20. The heat sink 10 is configuredfor thermally connecting with a heat generating electronic device (notshown) on a printed circuit board (not shown). The two clips 20 areconfigured for securing the heat sink 10 to the heat generatingelectronic device by fastening the two clips 20 to the printed circuitboard.

The heat sink 10 is an integral structure and made of a thermallyconductive material such as copper, aluminum, or an alloy thereof. Theheat sink 10 includes a base 11 and a fin array 12 extending from a topsurface of the base 11. The fin array 12 is composed of a number of finsparallel and spaced with each other. The fin array 12 includes twooutermost fins 121 respectively extending from two opposite ends of thetop surface of the base 11. Each of the two outermost fins 121 includesan inner surface 121 a and an outer surface 121 b.

The two clips 20 are removably mounted on any two fins of the fin array12. Preferably, the two clips 20 are mounted on two symmetrical fins ofthe fin array 12. In the present embodiment, the two clips 20 areremovably mounted on the two outermost fins 121. It is to be understoodthat the number of the clips 20 is not limited to be two, and thereforethe clips 20 are not limited to be mounted on two fins of the heat sink10, so long as the clips 20 can stably and reliably secure the heat sink10 to the printed circuit board on which the heat generating electronicdevice is mounted.

Each clip 20 is an integral structure and includes an elongatedresisting part 21, two stopping parts 22 and two locking parts 23. Thetwo locking parts 23 are respectively connected to two ends of theresisting part 21 and can be located on a same side or different sidesof the resisting part 21. In the present embodiment, the two lockingparts 23 are located on the same side of the resisting part 21, and areperpendicular to the resisting part 21. The two stopping parts 22 arearranged between the two locking parts 23, and can be connected to asame side or different sides of the resisting part 21. In the presentembodiment, the two stopping parts 22 are connected to the same side ofthe resisting part 21 and spaced from each other. Specifically, the twostopping parts 22 are respectively protruded and bent from two endportions of the resisting part 21.

The resisting part 21 is a rectangular sheet structure and includes aresisting surface 211 contacting with the inner surface 121 a of theoutermost fin 121, a side surface 212 opposite the resisting surface211, a bottom surface 213 contacting with the base 11, a top surface 214opposite the bottom surface 213, and two end surfaces 215. Two openings216 are defined in the resisting part 21, through the resisting surface211 and the side surface 212. The two openings 216 are located near thetwo end surface 215 respectively. In the present embodiment, each of thetwo openings 216 is a cutout opened from the bottom surface 213 of theresisting part 21, and is defined by two first surfaces 2161 and asecond surface 2162. The two first surfaces 2161 are parallel with thetwo end surface 215, and the second surface 2162 is parallel with thetop surface 214.

Each of the two stopping parts 22 includes a connection section 221 anda stopping section 222 connecting to the connection section 221. Eachconnection section 221 is bent and protruded from the resisting part 21.Specifically, each of the two connection sections 221 of the twostopping parts 22 is bent and protruded from one of the two firstsurfaces 2161 defining a corresponding opening 216 near a correspondingend surface 215, and extends for a suitable distance, e.g., a distanceequal to a thickness of the outermost fin 121. The two stopping sections222 straightly extend from the two connection sections 221 respectivelytoward each other. Each stopping section 222 is a flat plate andparallel with the resisting surface 211 of the resisting part 21.

A distance between each stopping section 222 and the resisting surface211 is equal to the thickness of the outermost fin 121; as a result, theoutermost fin 121 is limited between the resisting surface 211 and thetwo stopping sections 222 along a thickness direction of the outermostfin 121. A distance between two connection sections 221 of the twostopping parts 22 is equal to a width of the outermost fin 121; as aresult, the outermost fin 121 is limited between the two connectionsections 221 along a widthwise direction of the outermost fin 121.

Alternatively, the two stopping parts 22 can be substituted by anintegral structure. For example, the two stopping sections 222 of thetwo stopping parts 22 are connected together so as to form an integralstopping section. It is understood that structures, locations and thenumber of the stopping parts 22 could potentially be varied, so long asthe heat sink 10 is prevented by the stopping parts 22 from moving alonga widthwise direction of the fin of the heat sink 10.

The two locking parts 23 perpendicularly extend from two opposite endsof the resisting surface 211 along a direction away from the resistingsurface 211. The two locking parts 23 and the two stopping parts 22 canbe located at a same side or different sides of the resisting part 21.In the illustrated embodiment, the two locking parts 23 and the twostopping parts 22 are located at the same side of the resisting part 21.

Each of the two locking parts 23 includes a bending section 231connected to the bottom surface 213, and a locking section 232 used toengage with the printed circuit board. Each bending section 231 ispositioned between one end surface 215 and a corresponding opening 216near the one end surface 215. One end of the bending section 231 isconnected to one end surface 215, and the other end thereof is connectedto a corresponding first surface 2161 near the one end surface 215. Eachlocking section 232 is a rectangular plate, and has a through hole 230therein for allowing a bolt to extend therethrough to secure the heatsink 10 to the printed circuit board. It is understood that structures,locations and the number of the locking parts 23 could be varied, solong as the heat sink 10 can be fixed on the printed circuit boardsecurely by the locking parts 23.

In assembly, the two clips 20 are respectively mounted on the twooutermost fins 121 from a top end of the fin array 12 to a bottom end ofthe fin array 12. Thus, the two clips 20 and the heat sink 10 areassembled together to obtain the desired heat sink assembly 100.Regarding the heat sink assembly 100, the connection sections 221 of thestopping parts 22 engage the left and right ends of each outermost fin121; therefore, the two clips 20 are fixed along the widthwise directionof the outermost fins 121. At the same time, the stopping sections 222of the stopping pars 22 and the resisting surface 211 of the resistingpart 21 engage the outer and inner surfaces 121 b, 121 a of eachoutermost fin 121; therefore, the two clips 20 are fixed along thethickness direction of the outermost fins 121. Therefore, the two clips20 are limited along the widthwise and thickness directions of theoutermost fins 121, while are not limited along a height direction ofthe outermost fins 121. That is, the two clips 20 are removably mountedon the two outermost fins 121, wherein the two clips 20 can be removedfrom the heat sink 10 by moving the two clips 20 upwardly along theheight direction of the two outermost fins 121.

In disassembly, the two clips 20 are moved from the base 11 to top endsof the two outermost fins 121 to thereby separate from the heat sink 10.Therefore, the heat sink assembly 100 can be assembled or disassembledconveniently due to the two clips 20 being removably mounted on the twooutermost fins 121 of the heat sink 10. Apparently, in the assemblingand disassembling processes of the heat sink assembly 100, no additionaltool is needed and therefore the assembling and disassembling processesare greatly simplified.

When the heat sink 10 is required to be fixed on the printed circuitboard, the two clips 20 are located at the top surface of the base 11,the two locking parts 23 are fixed on the printed circuit board byextending bolts through the through holes 230 and the printed circuitboard to threadedly engage with a back plate at a bottom of the printedcircuit board. As a result, the heat sink 10 is fixed on the printedcircuit board to have an intimate contact with the heat generatingelectronic device.

It is believed that the present embodiments and their advantages will beunderstood from the foregoing description, and it will be apparent thatvarious changes may be made thereto without departing from the spiritand scope of the invention or sacrificing all of its materialadvantages, the examples hereinbefore described merely being preferredor exemplary embodiments of the invention.

1. A clip adapted for securing a heat sink to a printed circuit boardhaving a heat generating electronic device thereon, the heat sinkcomprising a base and a plurality of fins extending from a top surfaceof the base, the clip comprising: a resisting part adapted forcontacting with a fin of the heat sink when the clip is mounted to thefin; two locking parts respectively connected to two ends of theresisting part, and configured for securing the base of the heat sink tothe printed circuit board when the clip is mounted to the fin; and twostopping parts configured for preventing the clip from moving along awidthwise direction of the fin when the clip is mounted to the fin, thetwo stopping parts being connected to the resisting part and locatedbetween the two locking parts, the two stopping parts cooperating withthe resisting part adapted to prevent the clip from moving along athickness direction of the fin when the clip is mounted to the fin, theclip being adapted for being mountable to and removable from the finalong a height direction of the fin.
 2. The clip as claimed in claim 1,wherein the two locking parts are located at one of a same side ordifferent sides of the resisting part.
 3. The clip as claimed in claim1, wherein the two locking parts are perpendicularly connected to thetwo ends of the resisting part.
 4. The clip as claimed in claim 1,wherein the two stopping parts are located at one of a same side ordifferent sides of the resisting part.
 5. The clip as claimed in claim4, wherein the two stopping parts are respectively protruded and bentfrom two portions of the resisting part.
 6. The clip as claimed in claim1, wherein each of the two stopping parts comprises a connection sectionand a stopping section connecting to the connection section, theconnection section being perpendicular to the resisting part.
 7. Theclip as claimed in claim 6, wherein the resisting part comprises aresisting surface adapted for contacting with the fin, a bottom surfaceadapted for contacting with the top surface of the base, and two endsurfaces.
 8. The clip as claimed in claim 7, wherein two cutouts areopened from the bottom surface of the resisting part and located nearthe two end surfaces, respectively, each cutout is defined by two firstsurfaces parallel with the two end surfaces and a second surfaceinterconnected between the two first surfaces.
 9. The clip as claimed inclaim 8, wherein the two connection sections of the two stopping partsare respectively bent and protruded from the two first surfaces near theend surfaces.
 10. The clip as claimed in claim 8, wherein each of thetwo locking parts comprises a bending section connected to the bottomsurface, and a locking section adapted to engage with the printedcircuit board.
 11. The clip as claimed in claim 10, wherein one end ofthe bending section of each of the two locking parts is connected to oneend surface, and another other end thereof is connected to acorresponding first surface near the one end surface.
 12. A heat sinkassembly adapted for dissipating heat generated by a heat generatingelectronic device on a printed circuit board, the heat sink assemblycomprising: a heat sink comprising a base and a fin array extending froma top surface of the base; and at least one clip removably mounted on atleast one fin in the fin array, the at least one clip comprising: aresisting part contacting with a side of the at least one fin; twolocking parts respectively connected to two ends of the resisting part,and configured for securing the base of the heat sink to the printedcircuit board; and two stopping parts engaging with opposite ends of theat least one fin for preventing the at least one clip from moving alonga widthwise direction of the at least one fin, the two stopping partsbeing connected to the resisting part and located between the twolocking parts, the two stopping parts also contacting with an oppositeside of the at least one fin for preventing the at least one clip frommoving along a thickness direction of the at least one fin, the at leastone clip being removable from the at least one fin by moving upwardlyalong a height direction of the at least one fin.
 13. The heat sinkassembly as claimed in claim 12 further comprising another clip, the atleast one clip and the another clip being removably mounted on twosymmetrical fins of the fin array.
 14. The heat sink assembly as claimedin claim 13, wherein the at least one clip and the another clip areremovably mounted on two outermost fins of the fin array.
 15. The heatsink assembly as claimed in claim 14, wherein each of the two stoppingparts comprises a connection section and a stopping section connectingto the connection section, the connection section being bent andprotruded from the resisting part.
 16. The heat sink assembly as claimedin claim 15, wherein the resisting part comprises a resisting surfacecontacting with the side of the at least one fin of the fin array, abottom surface contacting with the top surface of the base, and two endsurfaces.
 17. The heat sink assembly as claimed in claim 16, wherein twocutouts are opened from the bottom surface of the resisting part andlocated near the two end surfaces, respectively, and each cutout isdefined by two first surfaces parallel with the two end surfaces and asecond surface interconnected between the two first surfaces.
 18. Theheat sink assembly as claimed in claim 17, wherein the two connectionsections of the two stopping parts are respectively bent and protrudedfrom the two first surfaces near the end surfaces.
 19. The heat sinkassembly as claimed in claim 18, wherein each of the two locking partscomprises a bending section connected to the bottom surface, and alocking section adapted to engage with the printed circuit board. 20.The heat sink assembly as claimed in claim 19, wherein one end of thebending section of each of the two locking parts is connected to one endsurface, and another other end thereof is connected to a correspondingfirst surface near the one end surface.